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1. SRA Soldering Products #ad
SRA Soldering Products Rosin Paste Flux #135 In A 2 oz Jar #adSRA Soldering Products #ad
- Active temperature range: 93 – 315°c/ 200 – 600°. Dimensions: 2. 5″ dia x 1″ h 64 x 25. 5 mm. Formulated for use with tin/lead and lead-free alloys.
The ideal flux for electrical and electronic repairs. Contains 2 ounce in a "Hockey puck" Jar. Does not need to be cleaned. Made in USA.
2. MG Chemicals #ad
MG Chemicals, 8341-10ML 8341 No Clean Flux Paste, 10 milliliters Pneumatic Dispenser Complete with Plunger & Dispensing Tip #adMG Chemicals #ad
- Compatible with lead free and leaded solder systems. Superior fluxing ability. Instant wetting. Thixotropic paste; RoHS compliant. After soldering, non conducting, moisture resistant, the rosin residue is non corrosive, and fungus resistant.
3. Jammas #ad
Jammas 2pcs Made in USA! 10cc NC-559-ASM Flux paste lead-free solder paste solder flux + Needles #adJammas #ad
- The lead free solder paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB. Package includes: 2pcs 559 10cc flux.
Our pastes are composed of environment-friendly flux and low oxidation spherical powder, high print definition, which were characterized by long continuous repeatability printing time, excellent solderability, and bright and smooth solder joint.
Made in usa! nc-559-asm lead-free solder paste solder flux 10cc. Asia general series no clean lead free solder Paste were developed according to IPC and JIS standards, and completely coinciding with RoHS directives.
4. QIANMO #ad
QIANMO HEZTANGH Paste 100% Original AMTECH NC-559-ASM BGA PCB No-Clean Solder Paste Welding Advanced Oil Flux Grease 10cc Soldering Repair Paste Weight : 5pcs #adQIANMO #ad
- Excellent capacity of solder-stickiness. Widely used on bga, pga, CSP packages and flip chip operation. Excellent Anti-wet Capacity. Suitable for multiple PCB reflow. No-clean and Lead free for environmental protection.
5. ChipQuik #ad
Chipquik Tack Flux no clean in a 10cc syringe w/plunger & tip, SMD291 #adChipQuik #ad
- Safe, affordable, easy and won't damage sensitive components. Remove qfds, plccs, soics and chip components without costly equipment. Low melting temperature. Special removal alloy has excellent wetting ability. Use with existing rework equipment or temp controlled soldering irons.
6. TekLine supply #ad
Kester RF741 No-Clean Electronics Rework Flux 6cc Syringe #adTekLine supply #ad
- 6cc syringe contains enough flux for 15-20 BGA repairs. 18 gauge dispensing tips as pictured for precision dispensing of flux. Compatible with most no-clean solders and fluxes. High viscosity- stays where you put it. Lead free - RoHS compliant.
7. Hyuduo #ad
Welding Flux NC559ASM with Needle Dispensing Tool Non Harmful Substances for Computer Home Appliance, Solder Paste Low Residue Flux #adHyuduo #ad
- Safe to usethe product is manufactured in accordance with strict quality standards before leaving the factory, with good safety performance and can be used with confidence.
Stable work stable work, more convenient and easy to use at work. It is mild and non-irritating, less smoke, and comes with 10 pack needles. Quality service we strive to provide you with high quality and convenient service.
Enough packagingthis product has a set of 10 solder pastes, which can perfectly replace the old ones and can meet your requirements. You are welcome to contact us if you have any problem about our product, we will give you a satisfactory reply. Low residue typespecial low-residue type, no need to clean, less residue after use, less smoke, strong fluidity, easy to use.
8. Amtech #ad
AMTECH NC-559-V2 no-clean tacky solder flux, 30cc kit #adAmtech #ad
- Rol0 flux classification - rosin based, low activity no-clean tacky solder flux for professional/industrial use. Use supplied blunt metal dispensing tip and plunger to manually control the flow. Every original shipment would include AMTECH Soldering Profiles card.
Surface insulation resistant. Wide process window - excellent performance on flip chip bumping and chip scale packaging sites. Applicable for a syringe, rework, stencil printing, BGA sphere attachment and reballing using standard tin/lead alloys not designed for lead-free. Low electrochemical migration